This facility makes printed circuit boards (PCBs) and etched components for industry. It also fabricates stainless steel etched parts, flexible copper circuits and multilayer PCBs.
This facility has been part of Oxford’s Physics Department for over 40 years, making PCBs and etched components both for the University and local industry.
The facility can fabricate solid etched parts, flexible copper circuits and multi-layer PCBs, while their conveyor system allows medium sized production runs to be made with a short turnaround time.
The facility has cleanroom facilities that allow device manufacture with mask aligner and both ball and wedge type bonders for gold and aluminum wire bonding.